Patterning Cleans
Surface Preparation and Cleans (SP&C) are integral processes in semiconductor manufacturing, ensuring the purity and precision required for advanced electronic devices.
Solutions built for the future
We are an innovative partner, that enables targeted etch and cleaning solutions for effective cleans of next-generation devices. Our comprehensive and customized solutions ensure high-quality cleans and etch technology for precise and efficient semiconductor manufacturing.
Our Products
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Post Etch Removers
Our ACT® products hold a strong position in IC Cleans which are also referred to as post etch residue or interconnect cleans.Explore -
Photoresist Removers
Our Dynastrip® and AZ® Removers are optimized for efficient Thick Film Photoresist Removal and widely used in Wafer Level Package Cleans.Explore -
Wet etchants
Focused on providing selective wet etchants for Logic and Memory.Explore -
Polymer Removal Chemistry
ExploreWith our Dynasolve® product line, we also serve the Industrial, Spray Foam & Non-Semiconductor Electronic market.
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All Cleaning Products
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What We Offer for Surface Preparation and Cleaning
Surface Preparation and Cleans (SP&C) are integral processes in semiconductor manufacturing, ensuring the purity and precision required for advanced electronic devices. These processes involve the meticulous removal of contaminants and residues from semiconductor wafers, which is crucial for the performance and reliability of microprocessors, memory, and logic chips.
Our SP&C solutions play a vital role in preparing the wafer surfaces for subsequent patterning and etching steps. This begins with advanced wet etch techniques, photoresist removal, and post etch residue cleaning, which are essential for achieving the high-quality surfaces needed for next-generation semiconductor devices.
Our Portfolio
We offer a well-rounded portfolio of Surface Preparation and Cleans solutions, positioning us as an innovative partner to advance the semiconductor manufacturing process.
Our expertise includes selective etchants for cutting edge applications, photoresist and post etch residue removal in Back End of Line (BEOL) cleans, photoresist and residue removal in Advanced Packaging applications.
We offer broad application support in various areas, including Advanced Selective Etch, BEOL cleans, photoresist removal, and cleans for Advanced Packaging.
We leverage our exceptional R&D capabilities to drive constant innovation towards efficient cleaning solutions.
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Capabilities
With a long history of removals and cleans solutions, we have established ourselves as a reliable partner in formulated wet cleans.
- We are continuous innovators that pushes the boundaries of cleans for new requirements in Advanced Packaging.
- Our long history and proven success of removals and clean solutions have established us as a reliable partner in formulated wet cleans.
- We collaborate closely with our customers to deliver tailored solutions faster, more accurately, and more efficiently.
Innovations for Tomorrow
We are committed to advancing our technologies to meet the future demands of semiconductor manufacturing.
Our continuous innovation focuses on sustainable solutions, including green solvent alternatives that are important to our customers. We are now pushing the boundaries of cleans for new requirements in Advanced Packaging, providing high-quality, outstanding compatibility, and effective cleaning to improve yield and performance.
Additionally, we are enhancing precision and efficiency by advancing selective wet etch technologies for Front End of Line (FEOL) applications.
By driving these advancements, we ensure that our technologies remain at the forefront of the industry, delivering the reliability and sustainability our customers expect.
Contact Us
Interested in working together? Get in touch to learn more.
Patterining Manufacturing and R&D Facilities
Our global reach, combined with localized supply chain expansion, ensures a reliable and timely supply of products, enhancing our customers' operational resilience and productivity.