Planarization
Planarization is a vital process in the manufacturing of semiconductor chips that ensures the surfaces of the chips are perfectly flat and smooth, enabling performance and reliability.
optimal wafer surface results
Planarization is an essential step in wafer processing that ensures the quality and reliability of electronic devices. The chemical-mechanical planarization process, known as “CMP”, is a step that removes excess material and evens out the surface, preventing electrical issues and enhancing device reliability. Achieving this smooth surface involves a complex mix of chemicals and polishing techniques. Planarization is an essential process that drives innovation and ensures the quality and reliability of electronic devices.
Planarization Offering
-
FEOL Dielectrics
STI, ILD and bulk oxide slurriesBrowse products -
BEOL Interconnects
Cu Bulk slurries & Cu Barrier slurriesBrowse products -
MOL MG & Contacts
W Bulk and Buff slurries, Co & Mo slurriesBrowse products -
Advanced Packaging
A wide variety of solutions for packaging applicationsBrowse products -
Silicon Polishing
Silica wafer polishing CMP slurriesBrowse product
What we offer
We are a global leading player in chemical mechanical planarization (CMP) technology and slurries, providing tailored solutions to optimize wafer surface results and address the stringent requirements of advanced nodes. We set new standards to provide innovative solutions quickly.
Our Portfolio in Planarization
We have a comprehensive Planarization portfolio to ensure superior surface uniformity and reduced defectivity in semiconductor devices. Our innovative solutions cover chemical additive and abrasive chemistry, integrated slurry and pCMP clean design, slurry formation design, and film property characterization.
Our Integrated CMP offerings and application areas
| Dielectics STI, ILD, Oxirde & Nit | BEOL Interconnects Cu Bulk/Barrier |
W and new metals Slurries |
Wafer Polishing Slurries |
Post CMP (pCMP) Cleans | |
|---|---|---|---|---|---|
STI2100/STI 2305/STI 2503 HPN8222/HPN822X (Nit Slurry) |
Cu3980/Cu3086 (Cu Bulk) Cu3940 (High-Rate Cu Bulk) Cu3886* (Low Dishing Cu Bulk) DP1196* (Ru barrier) BAR7080* (Adv Packaging Barrier) |
W5880/W6688 (W bulk) DP1236* (High Selectivity W) |
|
CP100/CP72B: Cu, CP98D: Cu/Co |
|
| *Development Product |
Capabilities
We leverage our broad R&D capabilities and global footprint to enable the speed of innovation. Our advanced technical capabilities range from R&D to high-volume manufacturing for advanced nodes.
- We serve as pioneers in planarization solutions for advanced node memory, advanced node logic, future interconnects, and advanced packaging.
- Our highly experienced team works with customers for product adoption, while further leveraging advanced analytics and quality control measures to provide end-to-end integrated solutions for optimal wafer surface results.
- We use holistic digital solutions and advanced analytics to stay ahead of the rapidly evolving semiconductor landscape.
We are highly skilled in decoding the complex interplay between materials and manufacturing methods, leveraging advanced analytics and quality control measures to empower our customers and encourage product adoption.
Partnerships
We partner closely with Intermolecular® and our digital and data enablement teams we bring end-to-end integrated solutions to the marketplace. The end-result for customers is fast access to new solutions for optimal wafer surface results.We leverage our global development and application resources for exceptional customer support.
Innovations For Tomorrow
We ensure that our customers stay ahead of the rapidly evolving semiconductor landscape. We empower them to optimize processes, raise yields, and accelerate innovation cycles by integrating holistic digital solutions and advanced analytics.
Our continuous innovation in chemical-mechanical planarization (CMP) focuses on developing cutting-edge sustainable solutions that enhance the performance and reliability of semiconductor devices.
We leverage our Materials Intelligence™ platform to pioneer planarization solutions for advanced node memory, advanced node logic, future interconnects, and advanced packaging.
Contact Us
Interested in working together? Get in touch to learn more.
We utilize our large capacity and global infrastructure for quick delivery, and local support.