Ormet® TLPS, DAP-481-1


Ormet® DAP-481-1 paste is an excellent alternative to solders or silver filled adhesives for electronic packaging applications requiring very high electrical and thermal conductivity.

  • Metal electrode
  • Die and substrate assembly
  • US
  • Korea
  • China
  • Taiwan
  • Japan
  • Europe
  • Sensors (MEMS, Optoelectronics)
  • Advanced Packaging
  • Industrial
  • Electronic
  • Ormet®

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Product info


Ormet® DAP-481-1 is a Pb-free, sintering paste formulated for attachment of metalized die to metalized lead-frame substrates. The paste is typically sintered at a peak temperature of 255°C but can be sintered at temperatures as low as 225°C. After sintering, Ormet® DAP-481-1 exhibits extremely high thermal stability beyond 350°C and will withstand subsequent lead-free reflow temperatures above 260°C without re-melting.

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