Ormet® TLPS, DAP-491-1

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Ormet® DAP-491-1 is a Pb-free, Transient Liquid Phase Sintering (TLPS) paste formulated for attachment of metalized die to metalized substrates.

Category:
  • Die and substrate assembly
Locations:
  • US
  • Korea
  • China
  • Taiwan
  • Japan
  • Europe
Industry:
  • Sensors (MEMS, Optoelectronics)
  • Advanced Packaging
  • Industrial
  • Electronic
Brands:
  • Ormet®

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Product info

Description

Ormet® DAP-491-1 is a Pb-free, Transient Liquid Phase Sintering (TLPS) paste formulated for attachment of metalized die to metalized substrates. Ormet® DAP-491-1 is processed via lead-free reflow but exhibits extremely high thermal stability beyond 350°C after sintering and will withstand subsequent lead-free reflow temperatures above 260°C without re-melting. Ormet® DAP-491-1 TLPS paste is an excellent alternative to gold-based and lead-based solders as well as silver-sintering materials for electronic packaging applications requiring high thermal conductivity, high-temperature stability along with standard SMT-compatibility for high-throughput.

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