Ormet® TLPS, DAP-491-1

Ormet^® DAP-491-1 is a Pb-free, Transient Liquid Phase Sintering (TLPS) paste formulated for attachment of metalized die to metalized substrates. Ormet^® DAP-491-1 is processed via lead-free reflow but exhibits extremely high thermal stability beyond 350°C after sintering and will withstand subsequent lead-free reflow temperatures above 260°C without re-melting. Ormet^® DAP-491-1 TLPS paste is an excellent alternative to gold-based and lead-based solders as well as silver-sintering materials for electronic packaging applications requiring high thermal conductivity, high-temperature stability along with standard SMT-compatibility for high-throughput.