Ormet® TLPS, XCAP-823-1


Ormet® XCAP-823-1 is a Pb-free, Transient Liquid Phase Sintering (TLPS) paste formulated for system-in-package (SiP) assembly and specifically designed for use in applications with a wide variety of components.

  • Die and substrate assembly
  • Components assembly
  • US
  • Korea
  • China
  • Taiwan
  • Japan
  • Europe
  • Sensors (MEMS, Optoelectronics)
  • Advanced Packaging
  • Industrial
  • Electronic
  • Ormet®

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Product info


Ormet® XCAP-823-1 is a high thixotropy, low-bleed formulation which exhibits outstanding performance in fine line/space, high-density applications where extra bond strength is required. After sintering, Ormet® XCAP-823-1 can withstand temperatures above 400°C without re-melting, allowing for subsequent reflows with outstanding reliability.

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