Al PERR Cleans needs
- The requirements for BEOL Al cleaning include Al line and vias cleaning, along with contact layer and bond pad cleaning.
- For advanced logic devices and leading-edge memory chips, copper is used for interconnects and an aluminium bond pad is used at top layers.
- Use Al bond pad at end of the requirement for Al clean only includes Al bond pad cleaning, may or may not include contact layer cleaning.
BEOL Al Cleans
See how our materials are used in a chip stack.
Specially formulated for effective removal of post-etch and ash residue during BEOL Cu integration.
Technical Challenges: To remove PERs at levels of Cu interconnect with minimal impact on other functional layers in the integration stack in a wet process.
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