Thick Film Resists
Enable the manufacturing of TSV, RDL & bumping in advanced packaging
TFR (Thick Film Resist) for backend packaging conductive circuitry is typically made by a bottom up metal plating process inside the same layer of a patterned TFR. Independently, resists for frontend processes are designed to develop circuitry patterns that are transferred to the substrate below through a patterned resist photolithography process. These advanced photoresist materials permit current manufacturing production equipment to produce next node products enabling your mobile lifestyle.