Photoresists for Back-End Applications
Enable the manufacturing of TSV, RDL & bumping in advanced packaging
Thick Film Resists (TFR) for backend packaging conductive circuitry is typically made by a bottom-up metal plating process inside the same layer of a patterned TFR.
Independently, resists for front-end processes are designed to develop circuitry patterns that are transferred to the substrate below through a patterned resist photolithography process. These advanced photoresist materials permit current manufacturing production equipment to produce next node products enabling your mobile lifestyle. See our front-end photoresist portfolio here.
What is a photoresist?
- A liquid solution spun on a substrate or wafer
- Acts like a photographic film. Photoresist is sensitive to and reacts chemically to light with various wavelengths
- Photoresist is resistant to wet metal plating solution or wet and dry etching
- Slightly alkaline aqueous solution developer creates a pattern
- Polymer (resistant to wet/dry etch)
- Photosensitive Active Compound (PAC)
- Photosensitive Acid Generator (PAG) or Photosensitive initiator (PI)
- Casting solvent to make resist spun-on possible
You benefit from
- TFR enables the manufacturing of patterned conductive circuitry (TSV, RDL and bumping)
- Sustainability: First commercialization in the world and long business history with more than 30 years without issue
- Leading position for TFR
- Total solution for various applications: Fine pitch, ultra thick, high resolution, good chemical resistance, controllable profile including vertical
- Cost savings: Low cost solution, high throughput, easy to strip, skip process step
- Very specialized for technical service: Our expertise solves your problem
- Experience at high end devices like automotive: Qualified automotive standard
Our product range
- 4000 Series
- IPS Series
- 3DT Series
- P4000 Series
- TF5000X Series
- PLP Series
- TPM 606
- 40XT - 11D
- 125nXT Series
... and talk to an expert about our products!