Photoresists for Back-End Applications

We offer a variety of Thick Film Resists from conventional DNQ & chemically amplified positive tone to photo polymerizing negative tone to make patterned conductive circuitry in semiconductor packages

Enable the manufacturing of TSV, RDL & bumping in advanced packaging

Thick Film Resists (TFR) for backend packaging conductive circuitry is typically made by a bottom up metal plating process inside the same layer of a patterned TFR. 

Independently, resists for frontend processes are designed to develop circuitry patterns that are transferred to the substrate below through a patterned resist photolithography process. These advanced photoresist materials permit current manufacturing production equipment to produce next node products enabling your mobile lifestyle. See our core resist portfolio here.

By {{ authorText(item) }}

{{ item.publicationDate }}


You have accessed, but for users from your part of the world, we originally designed the following web presence

Let's go

Share Disclaimer

By sharing this content, you are consenting to share your data to this social media provider. More information are available in our Privacy Statement