Silica wafer polishing CMP slurries: Syton, Mazin product for Wafer Polishing CMP

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Our wafer polishing slurries are designed by using colloidal silica abrasive and chemical additive formulation technology.

Category:
  • Silicon Polishing
Locations:
  • US
  • Korea
  • China
  • Taiwan
  • Japan
  • Europe
Industry:
  • Logic
  • Memory (DRAM, NAND, 3D NAND)
  • Sensors (MEMS, Optoelectronics)
  • Advanced Packaging

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Product info

Description

Our wafer polishing slurries are designed by using colloidal silica abrasive and chemical additive formulation technology. This product family has  proven HVM  quality consistency, low metals contamination and excellent cost of ownership. Main applications include both stock and intermediate polishing for a wide range of wafer sizes including 200mm and 300mm.

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