Bridging silicon and light: why the convergence of semiconductor technology and optronics is shaping the future
Publish Date
08 NOV 2025
Overview
Artificial intelligence (AI) is changing our industries and daily lives dramatically.
But at the center of it all is light: Rather than treating photons and electrons as separate information carriers, we harness both to elevate performance, efficiency, and user experience. In our Optronics business at Electronics, we have in-depth expertise in manipulating light. We provide solutions that arerevolutionizing not only screens, but the entire electronics ecosystem.
1. What exactly is convergence?
Convergence describes the use of advanced optical solutions in semiconductor workflows. Processes that handle photons and electrons now overlap across manufacturing and product development. Screens, which were once endpoints, are now tied to AI-driven processors and optical components to deliver immersive experiences. This synergy is highly evident in the field of Augmented Reality and Virtual Reality (AR/VR), where optical systems are integrated with high-performance logic for real-time rendering and stable visuals. Optics-silicon co-design is replacing siloed development, aligning materials, devices, and systems to shared performance goals.
2. Why convergence matters for performance and efficiency
Integrating optics into semiconductors unlocks higher bandwidth, lower latency, and reduced power consumption. As AI servers and edge devices hit limits in terms of electrical interconnects and thermal management, optical waveguides and light‑manipulating materials help route around bottlenecks. Liquid crystals, OLEDs, microLEDs, and advanced coatings enable precise light control, in turn delivering sharper images with lower energy consumption. Together, these gains enable thinner, faster devices that scale without overheating or draining batteries.
3. Where it’s already happening: AR/VR and beyond
AR/VR headsets showcase convergence. They rely on engineered optics (waveguides, microdisplays, lenses) and high‑performance semiconductors to process and project lifelike 3D environments. Components must be co‑optimized and aligned within tight tolerances to sustain immersion and comfort. The same principle extends to advanced packaging (heterogeneous integration), where memory, logic, and optics are manufactured separately, combined and co‑optimized with sub‑micron alignment. Enablers include metrology and inspection tools that validate each layer for reliability and efficiency.
Convergence is also accelerating in automotive applications (such as head‑up displays, sensor fusion, or embedded AI) and in data centers that seek more efficient data movement. As this deepens, displays are evolving: Windshields, walls, and wearables are becoming interactive surfaces. The boundary between compute, interconnect, and visualization is blurring, enabling context‑aware interfaces and spatial computing that adapts to the environment.
4. Photonics, optical computing, and our roadmap
Integrated photonics and optical computing are the next frontier, where lightspeed data transfer cuts energy use and heat. This trajectory aligns with Electronics’ roadmap, positioning our Optronics business as a bridge between optics and semiconductors. As AI infrastructure and high‑performance computing adopt optical input/output, co‑packaged optics, and on‑chip photonics, ultrafast photonic data movement will complement established silicon logic.
One critical pillar is metrology and inspection – advanced tools that ensure that each layer of a chip, display, or optical coating meets specifications. Following the acquisition and integration of metrology expert Unity‑SC into our Electronics business sector, our ability to measure and analyze cutting‑edge structures has advanced, helping manufacturers fine‑tune processes to exacting requirements. End‑to‑end process control, from materials to device to packaging, is becoming a differentiator.
5. Our collaboration with startups
Merck KGaA, Darmstadt, Germany has over a century of experience in display materials
– liquid crystals, OLEDs, and optical coatings – and this provides the foundation for what comes next. The chemistry and physics that produced vibrant screens now inform the next‑generation optical interconnects and waveguides that steer photons with precision. At the same time, we are developing semiconductor materials – e.g. thin films, for high‑bandwidth memory, advanced packaging, and other domains – that unlock new AI performance levels.
Collaboration is vital. Startups catalyze step changes, from novel microLED processes to new waveguide materials. Through M Ventures, our corporate venture capital arm, we align entrepreneurial agility with the manufacturing strength, quality expertise, and customer access of our company. Targeted alliances and focused R&D help accelerate convergence from both ends, display and semiconductor, while derisking scale‑up.
6. Keeping it real, and looking ahead
The shift to optronics opens new markets while strengthening our ability to deliver superior display solutions. As an innovation leader in display materials, we remain committed to our existing customers while exploring optics‑on‑chip, AR/VR, and photonics. Whether boosting transistor density or refining a waveguide to reduce latency, the aim is the same: to bridge the digital and physical worlds in ways that enrich how we live, work, and play.
We are entering an era where a display is no longer merely a screen but any surface that guides or generates light. Meanwhile, semiconductors, the once‑hidden brains behind it all, are evolving into photonic–electronic hybrids that move data at astonishing speeds. This is where Electronics aims to shine – leveraging deep expertise in chemistry and optics to help shape a global transformation of electronics.
Conclusion
The convergence of display and semiconductor technologies is more than a buzzword; it is a glimpse of tomorrow. Harnessing photons and electrons promises breakthroughs ranging from light‑based computing to immersive visuals woven into everyday environments. By pushing the boundaries of materials science and forging cross‑industry alliances, we aim to unlock a new era of innovation – from the smallest AI chips to the largest AR spaces. The best of display and semiconductor engineering lies ahead – and it is arriving faster than anyone imagined.