IEEE International Interconnect Technology Conference (IITC) 2025

This event is organized by The Korean Institute of Electrical and Electronic Material Engineers (KIEEME) & Ulsan National Institute of Science and Technology (UNIST).

Type of Event

Other

01 Jun 2025 - 05 Jun 2025

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Busan, South Korea

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The IEEE IITC will be held in Korea for the first time, focusing on advanced metallization and 3D integration for ULSI IC applications, covering all aspects of BEOL/MOL interconnec

FOR THE FIRST TIME!

The IEEE IITC will be held in Korea for the first time, focusing on advanced metallization and 3D integration for ULSI IC applications, covering all aspects of BEOL/MOL interconnects and reliability.

Our participation

  1. Mansour Moinpour

    Mansour Moinpour

    North America Program Chair

    　

Poster Presentations

  1. Nguyen Minh Vu

    Nguyen Minh Vu

    Senior Scientist

    Evaluation of ALD-grown MoS2 As Cu Diffusion Barrier Using Time-dependent Dielectric Breakdown

    05 Jun 2025 - FROM 17:30 TO 20:00 UTC+09:00

  3. Jingzhi Chen

    Jingzhi Chen

    Technology Lead

    Development of Advanced Cu CMP Slurry with Adjustable Planarization Efficiency and Dishing Levels

    05 Jun 2025 - FROM 17:30 TO 20:00 UTC+09:00

Co-author

With University of California San Diego (UCSD)

  • Novel Low Temperature Atomic Layer Annealing of Vertical Aligned Hexagonal Boron Nitride, 05 Jun 2025 - From 17:30 TO 20:00 UTC+09:00

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