IEEE International Interconnect Technology Conference (IITC) 2025
This event is organized by The Korean Institute of Electrical and Electronic Material Engineers (KIEEME) & Ulsan National Institute of Science and Technology (UNIST).
Type of Event
Other
FOR THE FIRST TIME!
The IEEE IITC will be held in Korea for the first time, focusing on advanced metallization and 3D integration for ULSI IC applications, covering all aspects of BEOL/MOL interconnects and reliability.
Our participation
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Mansour Moinpour
North America Program Chair
Poster Presentations
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Nguyen Minh Vu
Senior Scientist
Evaluation of ALD-grown MoS2 As Cu Diffusion Barrier Using Time-dependent Dielectric Breakdown
05 Jun 2025 - FROM 17:30 TO 20:00 UTC+09:00
Co-author
With University of California San Diego (UCSD)
- Novel Low Temperature Atomic Layer Annealing of Vertical Aligned Hexagonal Boron Nitride, 05 Jun 2025 - From 17:30 TO 20:00 UTC+09:00
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