Packaging (Back end Process)

Our Solutions

Integrated circuit packaging is the final stage of semiconductor device fabrication. The housing or package supports the electrical contacts that connect the integrated circuit chip to the circuit board.

We offer:

  • Thick film resists
  • Interconnects & Conductive pastes
  • LED Packaging

We offer a variety of Thick Film Resists from conventional DNQ & chemically amplified positive tone to photo polymerizing negative tone to make patterned conductive circuitry in semiconductor packages.

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Transient Liquid Phase Sintering Paste for production in densely assembled integrated circuits.

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