Packaging (Back end Process)


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Integrated circuit packaging is the final stage of semiconductor device fabrication. The housing or package supports the electrical contacts that connect the integrated circuit chip to the circuit board.

We offer:

  • Thick film resists
  • Interconnects & Conductive pastes
  • Phosphors for LED Lighting
  • LED Packaging

Thick film resists

We offer a variety of Thick Film Resists from conventional DNQ & chemically amplified positive tone to photo polymerizing negative tone to make patterned conductive circuitry in semiconductor packages.

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Interconnects & Conductive pastes

Transient Liquid Phase Sintering Paste for production in densely assembled integrated circuits.

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Phosphors for LED Lighting

Isiphor® - our Eye-catcher! In a world already shaped by amazing visual effects, our isiphor® phosphors open the door to a unique realm of vivid, eye-catching, and authentic colors for playing with light and illumination.

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LED Packaging

LED packages are a crucial part to ensure the quality of LEDs. They are protecting the LED chip from direct contact with the environment and encapsulate the chip with LED phosphors.

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