Packaging
Our offering: thick film resists, packaging cleans, slurries, and interconnect materials.
We have the solution...
...for megatrends and present challenges for packaging.
We deliver innovation...
…across the Advanced Packaging value chain with offerings in thick film resists, packaging cleans, slurries and interconnect materials.
Our Offering
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Thick fim resists
We offer a variety of Thick Film Resists from conventional DNQ & chemically amplified positive tone to photo polymerizing negative tone to make patterned conductive circuitry
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Packaging Cleans
High throughput, sustainable and customized removers and solvent cleans for RDL, Cu-pillar, TSV and debond
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Slurries & Cleans
Cu Bulk CMP, High Copper Removal Rate, low erosion, high selectivity to barrier/dielectrics
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Interconnect Materials
Transient Liquid Phase Sintering (TLPS) pastes; printed circuit board z-axis interconnects; EMI Conformal Shielding
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Find the right material
Our experts can help you find the right materials for your needs