Packaging

Our offering: thick film resists, packaging cleans, slurries, and interconnect materials.

  • Thick fim resists

    We offer a variety of Thick Film Resists from conventional DNQ & chemically amplified positive tone to photo polymerizing negative tone to make patterned conductive circuitry

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  • Packaging Cleans

    High throughput, sustainable and customized removers and solvent cleans for RDL, Cu-pillar, TSV and debond

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  • Slurries & Cleans

    Cu Bulk CMP, High Copper Removal Rate, low erosion, high selectivity to barrier/dielectrics

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  • Interconnect Materials

    Transient Liquid Phase Sintering (TLPS) pastes; printed circuit board z-axis interconnects; EMI Conformal Shielding

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Find the right material

Our experts can help you find the right materials for your needs