Packaging

Our offering: thick film resists, packaging cleans, slurries, and interconnect materials.

We have the solution...

...for megatrends and present challenges for packaging.

We deliver innovation...
We deliver innovation...

…across the Advanced Packaging value chain with offerings in thick film resists, packaging cleans, slurries and interconnect materials.

Our Offering

  • Thick fim resists

    We offer a variety of Thick Film Resists from conventional DNQ & chemically amplified positive tone to photo polymerizing negative tone to make patterned conductive circuitry
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  • Packaging Cleans

    High throughput, sustainable and customized removers and solvent cleans for RDL, Cu-pillar, TSV and debond
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  • Slurries & Cleans

    Cu Bulk CMP, High Copper Removal Rate, low erosion, high selectivity to barrier/dielectrics
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  • Interconnect Materials

    Transient Liquid Phase Sintering (TLPS) pastes; printed circuit board z-axis interconnects; EMI Conformal Shielding
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Adv Packaging Roadmap Adv Packaging Roadmap

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Technology Roadmap

We are aligning our solutions with Technology Roadmaps for advanced packaging
Our materials enable Our materials enable

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Materials for advanced packaging

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Integrated solutions

Find the right material

Our experts can help you find the right materials for your needs

Contact us