Our offering: thick film resists, packaging cleans, slurries, and interconnect materials.
We have the solution...
...for megatrends and present challenges for packaging.
We deliver innovation...
…across the Advanced Packaging value chain with offerings in thick film resists, packaging cleans, slurries and interconnect materials.
Thick fim resistsWe offer a variety of Thick Film Resists from conventional DNQ & chemically amplified positive tone to photo polymerizing negative tone to make patterned conductive circuitryDive Deeper
Packaging CleansHigh throughput, sustainable and customized removers and solvent cleans for RDL, Cu-pillar, TSV and debondDive deeper
Slurries & CleansCu Bulk CMP, High Copper Removal Rate, low erosion, high selectivity to barrier/dielectricsDive Deeper
Interconnect MaterialsTransient Liquid Phase Sintering (TLPS) pastes; printed circuit board z-axis interconnects; EMI Conformal ShieldingDive deeper
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