Advanced Oxide CMP slurries: STI Selective Oxide CMP, HPD Selective Oxide CMP

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Our Advanced Oxide CMP products are Highly Selective Oxide Slurry family with Stop-on-Film capability.

Category:
  • FEOL Dielectrics
  • Advanced Packaging
Locations:
  • Global
  • US
  • Korea
  • China
  • Taiwan
  • Japan
  • Europe
Industry:
  • Logic
  • Memory (DRAM, NAND, 3D NAND)
  • Sensors (MEMS, Optoelectronics)
  • Advanced Packaging
Brands:
  • DA Nano®

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Product info

Description

Our Advanced Oxide CMP products are Highly Selective Oxide Slurry family with Stop-on-Film capability. Designed by using ceria abrasive and chemical additive formulation technology, these products have  proven HVM quality consistency and strong global supply position. Main applications consists of interlayer dielectric/ILD and shallow trench isolation/STI for both P1 and P2 steps. Key performance differentiations include high removal rate, best-In-class topography and tunable dilution at point of use, all optimized for cost of ownership advantage.

FEOL Dielectrics STI & Oxide CMP
Advanced Oxide CMP Slurries

FEOL Dielectrics STI & Oxide CMP

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