Advanced Oxide CMP slurries: STI Selective Oxide CMP, HPD Selective Oxide CMP

Print

Our Advanced Oxide CMP products are Highly Selective Oxide Slurry family with Stop-on-Film capability.

Category:
  • FEOL Dielectrics
  • Advanced Packaging
Locations:
  • Global
  • US
  • Korea
  • China
  • Taiwan
  • Japan
  • Europe
Industry:
  • Logic
  • Memory (DRAM, NAND, 3D NAND)
  • Sensors (MEMS, Optoelectronics)
  • Advanced Packaging
Brands:
  • DA Nano®

By {{ authorText(item) }}

{{ item.publicationDate }}

Product info

Description

Our Advanced Oxide CMP products are Highly Selective Oxide Slurry family with Stop-on-Film capability. Designed by using ceria abrasive and chemical additive formulation technology, these products have  proven HVM quality consistency and strong global supply position. Main applications consists of interlayer dielectric/ILD and shallow trench isolation/STI for both P1 and P2 steps. Key performance differentiations include high removal rate, best-In-class topography and tunable dilution at point of use, all optimized for cost of ownership advantage.

Find the right material

Identifying the right product can be overwhelming. Our experts can help you find the most suitable solution for your needs.