Dynasolve® 700 Series Polymer Removal Solvents

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The Dynasolve® 700 Series solvents are reactive formulated solvents that are used to remove anhydride-cured epoxy, urethane, and silicone.

Category:
  • Polymer Removal Chemistries
Locations:
  • US
  • Korea
  • China
  • Taiwan
  • Japan
Industry:
  • Electronic
Brands:
  • Dynasolve®

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Product info

Description

The Dynasolve® 700 Series solvents are reactive formulated solvents that are used to remove anhydride-cured epoxy, urethane, and silicone. The solvents are used in both industrial and electronic applications. The four products differ in terms of aluminum capability, the presence or not of the solvent NMP, and REACH compliance (refer to the datasheet for more information).

Benefits of Dynasolve® 700 Series

  • More efficient than acetone, MEK & other solvents
  • All-in-one product works on several types of polymers
  • Formulated to be highly selective
  • High resin loading capacity allows for reuse and reduced cost of ownership
  • Multiple variants: NMP-free, REACH-compliant, aluminum-safe

Dynasolve® 700 Series Comparision Table

  Dynasolve 711 Dynasolve 715 Dynasolve 750 Dynasolve 760
Contains NMPYesNoYesNo
REACH CompliantNoYesNoYes
24 hr. Aluminum CompatibilityYesYesNoNo
Flash Point102°F (39°C)106°F (41°C)106°F (41°C)106°F (41°C)
Boiling Point248°F (120°C)248°F (120°C)248°F (120°C)248°F (120°C)
Specific Gravity0.990.991.011.01

Applications

Dynasolve® 700Series is suitable for use in:

  • Depotting and decapsulating electronic components
  • Industrial polymer removal (epoxy, silicone, urethane)
  • Cleaning manufacturing tools, mold systems, processing lines
  • Useful in environments where aluminum compatibility is critical

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