Research & Development
R&D in integrated circuits
We take a broad scope to R&D to be solutions provider for integrated circuits manufacturing processes.
Our Lithography Line consisting of Photoresists, Direct Self Assembly (DSA) Materials, and Patterning Enhancement Materials support fine pitch patterning through durable etching masks
Spin-on Technology (SOD) materials were developed for applications which require good gap filling property at particular dielectric layer. New precursors are being developed and commercialized for Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD) processes to meet the industries various demand for metal, oxide, nitride, or carbide thin films.
Nano-scale Silica Particles with unique properties are being developed for Chemical Mechanical Planarization (CMP) materials.
Sintering paste materials are developed to enable simplified process and pitch scaling interconnects at the back-end process.
The major Research & Development sites are globally spread in Japan (Shizuoka, Lithography and SOD), the United States (Massachusetts for Deposition R&D, Wisconsin for Deposition scale-up, New Jersey for Lithography, California for sintering paste), and France (LM, Silica particle).