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Advanced Packaging

New Challenges demand New Solutions.

Trust a proven leader in advanced packaging.

The electronics assembly and packaging industry (printed circuit board assembly) is constantly evolving to satisfy the requirements of the newest generation of semiconductors. Smaller footprint device sizes, 2.5D and 3D TSV packaging are just some of the changes that have occurred. With these changes come challenges—challenges we can help you solve.

New advanced designs and emerging technologies make it more critical to get solder joints perfect the first time. Optimizing reflow soldering, wave soldering, and selective soldering processes, we can help you achieve:

  • More process up time / Increased productivity
  • Improved cost of ownership
  • Overall defect reduction – shorts, icicles
  • Less waste /material usage


Let us put our experience in advanced packaging to work for you. We provide total solutions for your electronics packaging and assembly requirements with equipment, technology, and reliable gas supply. We have the expertise that comes from being a leading global supplier.

Semiconductor/IC Test, Assembly & Packaging

For a silicon chip or an integrated circuit to function, it needs to connect to the system that it will control or instruct. Integrated circuit assembly will provide connection of the integrated circuit for power and information transfer between the chip and the system. This is accomplished by connecting the chip to a package or directly to the printed circuit for these functions. Connections between the chip and the package or printed circuit board are via wire bonding or flip chip assembly. Our expertise, technologies and gas supply advantages can provide improved profits, uptime, and defect reduction, and improvement in the total cost of ownership for your integrated circuit board assembly and test processes.