13 Apr 2025
47th SESHA Annual Symposium 2025
The SESHA 2025 Annual Symposium will be held in Tempe at the new Omni.
Join us to explore groundbreaking technologies transforming the microelectronics sector and enabling smart applications.
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SEMICON Taiwan connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, academia, and research institutions.
Our team of specialists can help!
Download your kit to unlock exclusive content on our sustainability transformation & how our Materials Intelligence™ enables innovation for more sustainable solutions across the semiconductor value chain.
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SD, Head of Technology Strategy & Roadmap
Materials Intelligence for AI
05 Sep 2024 - FROM 10:30 TO 10:50 UTC+08:00
Head of Digital Solutions
Gen. AI for Smart Manufacturing
05 Sep 2024 - FROM 11:30 TO 11:55 UTC+08:00
EVP, Business Unit Head of Thin Films
Exploring New Frontiers of Materials. Advancing Semiconductor Technology Roadmaps
06 Sep 2024 - FROM 10:45 TO 11:05 UTC+08:00
Head of HR Taiwan
Talent Program: Global Semiconductor Strategies & Challenges: Diverse Talent Management and Cross-Cultural Innovation
05 Sep 2024 - FROM 10:30 TO 12:00 UTC+08:00
AI will not replace innovators, but innovators who use AI will replace innovators who don’t.
Press Releases
We launched M-Trust™, a secure cyber-physical trust platform, addressing growing issues of product safety, traceability and counterfeiting.
2025/01/06
Press Releases
Merck KGaA, Darmstadt, Germany and Intel launch academic research program, involving eleven scientific institutions from six European countries.
2024/11/06
Press Releases
Merck KGaA, Darmstadt, Germany, completes acquisition of Unity-SC and strengthens Optronics offering to better serve the semiconductor industry.
2024/10/31
The SESHA 2025 Annual Symposium will be held in Tempe at the new Omni.
Join us for an engaging webinar exploring the transformative benefits of data sharing in the semiconductor industry, including zero quality issues, materials optimization, and scaling up new technology nodes.