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International Conference on Planarization / CMP Technology (ICPT) 2026

This event is organized by ICPT, CMPUGM, and KAPAR.

  • Type of Event

    Other

  • Our Participation

    Exhibitor

Meet us

Meet our experts at ICPT 2026 - Explore collaboration opportunities at Booth 24.

Exhibit Hours: 

  • Oct 20-21: 8:00-18:30 KST
  • Oct 22: 8:00-12:30 KST

Overview

Elevate your networking and technical expertise to the next level at ICPT! With premier technical sessions, interactive poster presentations, and a high-energy exhibition floor, you will connect directly with peers and leaders from global IDMs, foundries, equipment and consumable suppliers, and top-tier research institutions.

Build lasting relationships, meet new collaborators, and discover groundbreaking innovations in FEOL/BEOL CMP, advanced packaging for HBM, and hybrid bonding—all within four days that bring together the entire international planarization community.

Technical Leadership Presentations

  1. Ping Tzeng, PhD

    Ping Tzeng, PhD

    Senior Scientist

    The Interconnect Advantage: CMP Powering AI and HBM

    22 Oct 2026 - FROM 18:30 TO 11:45 UTC+09:00

Poster Session

  1. Ping Tzeng, PhD

    Ping Tzeng, PhD

    Senior Scientist

    Copper CMP Slurry Tailored for Applications with Different Dimensions

    20 Oct 2026 - FROM 13:00 TO 15:15 UTC+09:00

Need support finding the right materials solutions?

     Our team of specialists can help!

 

Webinar Series

Watch our free on-demand webinar to discover how how digital solutions are forming new ways of operating in a fast-paced, highly demanding semiconductor industry. Click here and find our webinars!

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