International Conference on Planarization / CMP Technology (ICPT) 2026

Name: International Conference on Planarization / CMP Technology (ICPT) 2026
Start: 2026-10-19T00:00:00.000+08:00
End: 2026-10-22T23:00:00.000+08:00

This event is organized by ICPT, CMPUGM, and KAPAR.

Type of Event

Other
Our Participation

Exhibitor

19 Oct 2026 - 22 Oct 2026

Event Website

Seoul, South Korea

Overview

Elevate your networking and technical expertise to the next level at ICPT! With premier technical sessions, interactive poster presentations, and a high-energy exhibition floor, you will connect directly with peers and leaders from global IDMs, foundries, equipment and consumable suppliers, and top-tier research institutions.

Build lasting relationships, meet new collaborators, and discover groundbreaking innovations in FEOL/BEOL CMP, advanced packaging for HBM, and hybrid bonding—all within four days that bring together the entire international planarization community.

Technical Leadership Presentations

Ping Tzeng, PhD

Senior Scientist
The Interconnect Advantage: CMP Powering AI and HBM

22 Oct 2026 - FROM 18:30 TO 11:45 UTC+09:00

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Webinar Series

Watch our free on-demand webinar to discover how how digital solutions are forming new ways of operating in a fast-paced, highly demanding semiconductor industry. Click here and find our webinars!