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The Future of Photonics - Materials Matter
Executive networking conference for leaders shaping integrated photonics, materials, and deployment at scale – hosted by Merck KGaA, Darmstadt, Germany.
Type of Event
In-Person
Our Participation
Owner
16 Apr 2026 - 17 Apr 2026
Join us for the inaugural conference hosted by Merck KGaA, Darmstadt, Germany, focusing on Silicon Photonics. With rising interest from key industry players, this is a prime opportunity to engage with leaders in integrated photonics, materials, and large-scale deployment. Over 2 days, participate in dynamic forums and networking sessions designed to foster collaboration, innovation and partnership with the company. Don`t miss your chance to connect and shape the future of photonics!
Presenters
Global Foundries/ NewPhotonics/ IBM/ Siemens/ Polariton/ Polaris/ NVIDIA/ Trumpf/ EVG/ LightCounting/ EMD Electronics/ STMicroelectronics/ Schott/ Coherent/ Heraeus/ Tower Semiconductor/ Luceda Photonics/ Suss/ Ligentec/ Samsung Electronics/ Imec…
Topics & Exploration Area
• How will integrated Photonics reshape computing and the industry landscape?
• What will be required - and what role will advanced material solutions play?
• How can Europe position itself successfully in this transition?
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High-speed optical interconnects
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Photonic/Electronic integration
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Advanced modulators and materials
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Metrology & Inspection
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Packaging
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Real-world deployments in data centers and telecom
- Knowledge and insights: Keynotes, roundtables and expert presentations with cutting-edge content on trends, technologies, and challenges.
- Networking opportunities: meaningful connections with peers and pathways for collaboration.
- Visibility and recognition: platforms to present your work plus press coverage to extend your reach.
- Fun and engagement: a relaxed networking dinner and interactive experiences that make the event enjoyable and memorable.
Agenda
| Day 1 | |||
|---|---|---|---|
| From | To | What | Who |
| 08:30 | 11:00 | Site Tour (9:00) & Registration | |
| 11:00 | 11:15 | Opening Remarks | Benjamin Hein - CEO of the Electronics business of Merck KGaA, Darmstadt, Germany |
| 11:15 | 11:45 | The Materials Dilemma in Integrated Photonics | Roel Baets - Emeritus Prof. at Ghent University & imec |
| 11:45 | 12:05 | Opportunities for Integrating Photonics deep into Computing Systems | Bert Offrein - Principal Research Scientist / Professor at IBM Research Europe |
| 12:05 | 13:05 | Lunch | |
| 13:05 | 13:35 | CPO Material Breakthroughs | Elad Mentovich - Sr. Principle Engineer at Nvidia |
| 13:35 | 13:55 | Enabling Reliable Optical Coupling: Material Strategies for Photonic Integration | Oliver Matyssek - Product Manager at DELO Industrial Adhesive |
| 13:55 | 14:15 | Integrated Photonics Design: Streamlining the Path to PIC Innovation | Thomas Heurung - Technical Director at Siemens EDA |
| 14:15 | 14:35 | How Luceda Empowers the PIC Value Chain | Nirav Annavarapu - Sales & Application Engineer at Luceda Photonics |
| 14:35 | 15:35 | Networking Event | |
| 15:35 | 16:05 | Accelerating the Transition to Optics | Jean‑Baptiste Laloë - Director of Technology & Strategic Partnerships at Global Foundries |
| 16:05 | 16:25 | Liquid Crystal Photonics: Enabling Next Gen Silicon Photonics | Morten Nissov - CEO of Polaris Electro-Optics |
| 16:25 | 16:45 | Material Frontiers in Photonic Integration: Unlocking the Potential of Silicon, Organics, and Metals | Claudia Hoessbacher - CEO of Polariton |
| 16:45 | 17:15 | Coffee Break | |
| 17:15 | 17:35 | New modulator Material Development for Silicon Photonics | Tomas Bäcklund - Director Integrated Photonics at the Electronics business of Merck KGaA, Darmstadt, Germany |
| 17:35 | 17:55 | Advanced Materials in Silicon Photonics Foundry | Yakov Roizin - Chief Scientist and Fellow of Tower Semiconductor |
| 17:55 | 18:25 | Panel Discussion | |
| 18:25 | 18:35 | Closing Remarks | Mark Goebel - CTO-Fellow at the Electronics business of Merck KGaA, Darmstadt, Germany |
| 19:05 | 22:05 | Networking Dinner (Mathildenhöhe) | |
| Day 2 | |||
|---|---|---|---|
| From | To | What | Who |
| 09:00 | 09:15 | Opening Remarks | Dieter Schroth - Senior Director Transformation at the Electronics business of Merck KGaA, Darmstadt, Germany |
| 09:15 | 10:00 | Modulator Technologies: A Market Perspective | Roy Rubenstein - Consultant at LightCounting |
| 10:00 | 10:30 | Coffee Break | |
| 10:30 | 11:00 | Enabling Cloud Optical Interconnects for AI Datacenters Through High‑Volume Production | Gregory Maurel - Marketing Manager for the RF and Optical Communication at STMicroelectronics |
| 11:00 | 11:20 | Low loss Photonic Integrated Circuits through Heterogeneous Integration | Michael Geiselmann - Co-Founder & CCO of Ligentec |
| 11:20 | 11:40 | Co-Packaged Optics and Use of Nanoimprint and Inkjet | Sajid Qadir - Technology Scout at SUSS MicroTec SE |
| 11:40 | 12:00 | Technical and Optical Glasses for Future Photonic Applications | Degenhart Hochfilzer - New Business Development Manager at SCHOTT AG |
| 12:00 | 12:30 | Panel Discussion | |
| 12:30 | 13:30 | Lunch | |
| 13:30 | 13:50 | Package and Material Challenges of Optical Engine Integration | Kimin Jun - Master and Vice President of Technology at Samsung Electronics |
| 13:50 | 14:20 | Advance Thermal Management Materials Enable AI | Rob Murano - Sr. Director of Product Development and Commercialization at Coherent |
| 14:20 | 14:40 | Materials-Driven Interconnection for Advanced Packaging and Photonic Transceivers | Chia-Ju (Joyce) Yu - Head of Marketing Semiconductor at Heraeus |
| 14:40 | 15:10 | Coffee Break | |
| 15:10 | 15:30 | Laser Processes for Through-Glass and Through-Silicon Vias | Max Kahmann - Intellectual Property Manager at TRUMPF |
| 15:30 | 15:50 | Enabling Scalable Photonic Packaging using Nanoimprint Lithography | Andrea Kronawitter - Business Development Manager at EV Group (EVG) |
| 15:50 | 16:05 | Closing Remarks | Damien Tuleu - EVP Optronics at the Electronics business of Merck KGaA, Darmstadt, Germany |
| 16:05 | End | ||
