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Disclaimer
Publication of Merck KGaA, Darmstadt, Germany.
In the United States and Canada the subsidiaries of
Merck KGaA, Darmstadt, Germany operate under the umbrella brand EMD.
Our ACT® products hold a strong position in IC Cleans which are also referred to as post etch residue or interconnect cleans.
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Al PERR Cleans needs
The requirements for BEOL Al cleaning include Al line and vias cleaning, along with contact layer and bond pad cleaning.
For advanced logic devices and leading-edge memory chips, copper is used for interconnects and an aluminium bond pad is used at top layers.
Use Al bond pad at end of the requirement for Al clean only includes Al bond pad cleaning, may or may not include contact layer cleaning.
BEOL Al Cleans
See how our materials are used in a chip stack.
Cu BEOL
Specially formulated for effective removal of post-etch and ash residue during BEOL Cu integration.
Cu BEOL
Technical Challenges: To remove PERs at levels of Cu interconnect with minimal impact on other functional layers in the integration stack in a wet process.
