Integrated materials solution
We solve complex problems
Do you have metallization, pattern transfer, 3D scaling or atomic integration challenges? Have you wondered: am I facing a hardmask challenge or a dry etch optimization? We can solve these problems with you.
We speed time to innovation
By combining our competencies across the different materials and processes within semiconductors, we enable you to design next generation devices faster and more efficiently.
Customize to your needs
We can customize for specific needs and optimize time to market, and re-use certain processes for improved efficiency, productivity and total cost of ownership.
Develop advanced nodes
We remove internal steps and accelerate the time to develop advanced technology nodes and novel architectures.
Integrated Materials Solution In Action
3D NAND challenge
One example of integrated materials solutions is how we can address process integration challenges associated with increased memory density for 3D NAND.
Deeper holes Chanllenges
To increase memory density you need deeper holes. And you must overcome 3 key challenges.
We co-optimize 2 processes (deposition & etching) to develop a better, faster solution. And the result is deeper, cleaner, straighter holes for increasing memory for 3D NAND.
Chat with an expert
Partnership is the ultimate competitive advantage. Let's work closely together to develop new products and maximize the effectiveness of our R&D.