BPS-170

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BPS-170 aqueous copper oxide remover reduces contact resistance during probe/test, reduces the oxide thickness on aged flip chip bumps, and serves as a replacement for copper and aluminum microetch.

Category:
  • Litho Cleans
Locations:
  • Global
  • US
  • Korea
  • China
  • Taiwan
  • Japan
  • Europe
Industry:
  • Semiconductors

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Product info

Description

BPS-170 aqueous copper oxide remover reduces contact resistance during probe/test, reduces the oxide thickness on aged flip chip bumps, and serves as a replacement for copper and aluminum microetch in various copper/aluminum processes. This product removes oxide from bumps, bond pads, metal contacts and other interconnect layers.

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