BPS-729A is a surfactant formulated low resistivity dicing solution has been specially formulated for high conductivity dicing applications such as ESD sensitive CMOS and image sensors, without the need for CO2 sparging. During the dicing process, this product is also capable of preventing galvanic corrosion and removing metal oxides off bond pads without damaging metals, silicon, passivation, polyimides and photoresists. This results in cleaner, shinier bond pads that can lead to direct improvements in bond reliability.
