Our Copper Barrier CMP products are tunable Slurries designed to meet performance requirements for removal rate with Copper, Liners and dielectric e.g. Low K rate tunability.
- BEOL Interconnect
- Advanced Packaging
- US
- Korea
- China
- Taiwan
- Japan
- Europe
- Logic
- Memory (DRAM, NAND, 3D NAND)
- Sensors (MEMS, Optoelectronics)
- Advanced Packaging
- DA Nano®