Dynasolve® FS8320 Semiaqueous Flux Remover for Wafer Level Packaging

Print

Dynasolve® FS8320 Semiaqueous Flux Remover for Wafer Level Packaging is designed to be effective at the removal of baked-on solvent-based flux residues.

Category:
  • Litho Cleans
Locations:
  • Global
  • US
  • Korea
  • China
  • Taiwan
  • Japan
  • Europe
Industry:
  • Advanced Packaging
Brands:
  • Dynasolve®

By {{ authorText(item) }}

{{ item.publicationDate }}

Product info

Description

Dynasolve® FS8320 Semiaqueous Flux Remover for Wafer Level Packaging is designed to be effective at the removal of baked-on solvent-based flux residues. It is an excellent choice for removal of flux residues from wafers after the bumping process. Dynasolve® FS8320 is exceptionally safe on all solder types including lead-free, high-lead, and eutectic. It can also be used for removal of misprinted photoresists.

Find the right material

Identifying the right product can be overwhelming. Our experts can help you find the most suitable solution for your needs.

Contact us