KrF Thick film resists

Print

KrF thick film resists perform high sensitivity and high resolution with excellent pattern profile. Good etch resistance and ion implantation tolerance enable several applications for IC device manufacturers.

Category:
  • KrF Thick-film Resists
Locations:
  • Global
  • US
  • Korea
  • China
  • Taiwan
  • Japan
  • Europe
Industry:
  • Semiconductors
Brands:
  • AZ®

By {{ authorText(item) }}

{{ item.publicationDate }}

THICK FILM RESISTS FOR BACK-END PROCESSES

Thick Film Resists (TFR) for back-end packaging conductive circuitry is typically made by a bottom-up metal plating process inside the same layer of a patterned TFR. They enable the manufacturing of TSV, RDL & bumping in advanced packaging.

TFR Basic Process TFR Basic Process

1/3

TFR Technology Overview TFR Technology Overview

2/3

TFR Trends In Advanced Packaging TFR Trends In Advanced Packaging

3/3

z

Find the right material

Identifying the right product can be overwhelming. Our experts can help you find the most suitable solution for your needs.

Contact us