Interconnects and Conductive Pastes

Transient Liquid Phase Sintering Paste for production in densely assembled integrated circuits

TLPS (Transient liquid phase sintering)

Integrated circuit packaging is the final stage of semiconductor device fabrication. The case or housing known as the package supports the electrical contacts that connect the device to the circuit board. TLPS sintering metal pastes enable the electrical interconnection and thermal management in concentrated electronic substrates and system in package modules.

Sintering pastes are lead-free and demonstrate high electrical and thermal conductivity. When heated, they undergo a transformation called Transient Liquid Phase Sintering (TLPS), forming a strong metallic bond to solder ready surfaces. Once sintered, the newly formed intermetallic will not reflow, thereby increasing the reliability of devices in high operating temperature and harsh environments such as automotive. Sintered paste technology is an alternative to soft solders that meet performance and reliability requirements through years in customer field use.

Sintering paste forming under glass

During rate of rise, temperatures reaching (140°-220°) display the Sn alloy fusing to the copper forming an intermetallic network that sinters the copper powder forming a solid metal network. The forming metal network will alloy to any adjacent solder ready surface.

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