April 12, 2022 | 4:00 pm - 5:00 pm CET

4:00 pm CET - Introduction by Laith Altimime | President, SEMI Europe 

4:05 pm CET - Welcome remarks by Anand Nambiar | Global Head, Semiconductor Materials 

4:15 pm CET - Overcoming EUV Lithography Barriers through DSA Technology by Jerome Wandell | Technical Marketing Manager & Durairaj Baskaran | Research Fellow

4:45pm CET - Q&A Moderated by Laith Altimime and Conclusions by Anand Nambiar | President, SEMI Europe and Global Head, Semiconductor Materials 

Jerome Wandell has spent 25 years working in semiconductor lithography, covering many aspects of the field, including process development, photoresist formulation chemistry, and design-to-mask (OPC). His current role is Technical Marketing Manager for the Directed Self-Assembly (DSA) materials portfolio of the Patterning Solutions group for the Electronics business of Merck KGaA, Darmstadt, Germany. Jerry received a bachelor's degree in Microelectronic Engineering from the Rochester Institute of Technology and is now based in Saratoga Springs, NY. His prior roles in lithography were at GLOBALFOUNDRIES, Rohm & Haas, and ASML.

Dr. Durairaj Baskaran is a Research Fellow in the Electronics business of Merck KGaA, Darmstadt, Germany. He develops materials for the directed self-assembly of block copolymers and selective monolayers for applications in advanced patterning. He has over 25 years of experience in designing macromolecules and taught "Organic Chemistry of Polymers" at the University of Tennessee for many years, before moving into the industry. He has published 100+ research articles in peer-reviewed international journals, edited a book, and filed several US and Indian patents. He has also directed industrial research projects from Solvay (Italy), P&G (US), GE (India), as well as obtained grants from the Office of Naval Research (Navy), NSF, and US army.