Select your Market

IEEE International Interconnect Technology Conference (IITC) 2026

IITC is sponsored by the IEEE Electron Devices Society.

  • Type of Event

    Other

Poster Presentations

  1. Jay Chiu

    Jay Chiu

    R&D Senior Scientist

    P20. Breaking the Thickness-Continuity Limit: Ultrathin ALD Pt via Novel Chemical Continuity Enhancement

    03 Jun 2026 - FROM 17:30 TO 19:30 UTC-07:00

  2. Dnyanesh Tamboli

    Dnyanesh Tamboli

    Senior Technology Manager​

    P29. Enabling Thick Copper CMP Applications Through Innovative CMP Slurry Design

    03 Jun 2026 - FROM 17:30 TO 19:30 UTC-07:00

Co-author

With University of California San Diego (UCSD)

  • P16. Thickness Dependent Thermal Boundary Conductance in Ultrathin BEOL-Compatible ALA h-BN films | Diego Contreras Mora, Ping Che Lee, Amy Ross, Haripin Chandra, Larry Chen, Ravi Kanjolia, Mansour Moinpour, Andrew Kummel | Jun 3 from 17:30 to 19:30 PDT

Contact us

  • Interested in working together or need support finding the right materials solution? Click here to connect us.
  • Curious about how it is to work with us as an employee? Chat with one of our colleagues directly using our interactive Q&A tool.
     

Webinar Series

Watch our free on-demand webinar to discover how how digital solutions are forming new ways of operating in a fast-paced, highly demanding semiconductor industry. Click here and find our webinars!

Related News

View All News
  1. Press Releases

    Computational Chemistry and AI in Chemistry Conference at Headquarters in Darmstadt

    We have hosted one of the largest conferences focusing on computational chemistry and AI in chemistry with around 300 participants in Darmstadt.

    2026/09/21

  2. Press Releases

    2026 Future Insight Prize Goes to Spear’s Vasilis Ntziachristos

    The € 300,000 research grant award recognizes Ntziachristos’ pioneering work in enabling non-invasive and continuous monitoring of human biology.

    2026/06/23

  3. Press Releases

    Merck KGaA, Darmstadt, Germany, Opens €20 million Metrology and Inspection ...

    New site expands capacity for M&I tools fivefold, supporting chip manufacturers in advanced packaging and heterogeneous integration for AI chips.

    2026/05/05

Upcoming Event

View All Events