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IEEE International Interconnect Technology Conference (IITC) 2026

IITC is sponsored by the IEEE Electron Devices Society.

Type of Event

Other

Our participation

  1. Mansour Moinpour

    Mansour Moinpour

    North America Program Chair

     

Poster Presentations

  1. Jay Chiu

    Jay Chiu

    R&D Senior Scientist

    P20. Breaking the Thickness-Continuity Limit: Ultrathin ALD Pt via Novel Chemical Continuity Enhancement

    03 Jun 2026 - FROM 17:30 TO 19:30 UTC-07:00

  2. Dnyanesh Tamboli

    Dnyanesh Tamboli

    P29. Enabling Thick Copper CMP Applications Through Innovative CMP Slurry Design

    03 Jun 2026 - FROM 17:30 TO 19:30 UTC-07:00

Co-author

With University of California San Diego (UCSD)

  • P16. Thickness Dependent Thermal Boundary Conductance in Ultrathin BEOL-Compatible ALA h-BN films | Diego Contreras Mora, Ping Che Lee, Amy Ross, Haripin Chandra, Larry Chen, Ravi Kanjolia, Mansour Moinpour, Andrew Kummel | Jun 3 from 17:30 to 19:30 PDT

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Webinar Series

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