IEEE International Interconnect Technology Conference (IITC) 2026
IITC is sponsored by the IEEE Electron Devices Society.
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Type of Event
Other
Poster Presentations
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Jay Chiu
R&D Senior Scientist
P20. Breaking the Thickness-Continuity Limit: Ultrathin ALD Pt via Novel Chemical Continuity Enhancement
03 Jun 2026 - FROM 17:30 TO 19:30 UTC-07:00
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Dnyanesh Tamboli
Senior Technology Manager
P29. Enabling Thick Copper CMP Applications Through Innovative CMP Slurry Design
03 Jun 2026 - FROM 17:30 TO 19:30 UTC-07:00
Co-author
With University of California San Diego (UCSD)
- P16. Thickness Dependent Thermal Boundary Conductance in Ultrathin BEOL-Compatible ALA h-BN films | Diego Contreras Mora, Ping Che Lee, Amy Ross, Haripin Chandra, Larry Chen, Ravi Kanjolia, Mansour Moinpour, Andrew Kummel | Jun 3 from 17:30 to 19:30 PDT
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2026/06/23
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Press Releases
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2026/05/05
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Information
AGM: Beckmann to be appointed as CEO May 1
Belén Garijo passed symbolically the baton to Kai Beckmann. Annual General Meeting approved dividend of € 2.20.
2026/04/24
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