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IEEE International Interconnect Technology Conference (IITC) 2026

IITC is sponsored by the IEEE Electron Devices Society.

Type of Event

Other

Poster Presentations

  1. Jay Chiu

    Jay Chiu

    R&D Senior Scientist

    P20. Breaking the Thickness-Continuity Limit: Ultrathin ALD Pt via Novel Chemical Continuity Enhancement

    03 Jun 2026 - FROM 17:30 TO 19:30 UTC-07:00

  2. Dnyanesh Tamboli

    Dnyanesh Tamboli

    Senior Technology Manager​

    P29. Enabling Thick Copper CMP Applications Through Innovative CMP Slurry Design

    03 Jun 2026 - FROM 17:30 TO 19:30 UTC-07:00

Co-author

With University of California San Diego (UCSD)

  • P16. Thickness Dependent Thermal Boundary Conductance in Ultrathin BEOL-Compatible ALA h-BN films | Diego Contreras Mora, Ping Che Lee, Amy Ross, Haripin Chandra, Larry Chen, Ravi Kanjolia, Mansour Moinpour, Andrew Kummel | Jun 3 from 17:30 to 19:30 PDT

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