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SEMICON Taiwan 2026

This event is organized by SEMI.

  • Type of Event

    Conference

  • Our Participation

    Sponsor

31 Aug 2026 - 04 Sep 2026

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Meet us

SEMICON Taiwan will take place from September 2 to 4, 2026, at TaiNEX 1 and TaiNEX 2. Conference runs August 21–September 4 and spans TaiNEX 1 & 2, Grand Hilai Taipei, and Grand Luxe Banquet.Exhibition is September 2–4. Visit us at R503, 5F, TaiNEX 1.

CEO Summit

  1. Benjamin Hein

    Benjamin Hein

    Member of the Executive Board and CEO of EL

    Driving Semiconductor Innovation Velocity with Integrated Workflow Solutions

    02 Sep 2026 - FROM 11:50 TO 12:15 UTC+08:00

IC Forum

  1. Surésh Rajaraman

    Surésh Rajaraman

    CTO of Electronics

    Advancing Materials Innovation Velocity with AI

    31 Aug 2026 - FROM 9:40 TO 10:05 UTC+08:00

Smart Manufacturing Forum

  1. Paul Kim

    Paul Kim

    Digital Transformation Engineer

    Agentic AI on Operational Ontology Layer for Autonomous Manufacturing Intelligence

    01 Sep 2026 - FROM 11:05 TO 11:30 UTC+08:00

Strategic Materials Conference

  1. Bing Han

    Bing Han

    Head of Thin Films BU

    Materials Innovation and Ecosystem Resilience Enabling AI Performance

    03 Sep 2026 - FROM 10:00 TO 10:20 UTC+08:00

Need support finding the right materials solutions?

     Our team of specialists can help!

 

Webinar Series

Watch our free on-demand webinar to discover how how digital solutions are forming new ways of operating in a fast-paced, highly demanding semiconductor industry. Click here and find our webinars!

Related News

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  1. Press Releases

    2026 Future Insight Prize Goes to Spear’s Vasilis Ntziachristos

    The € 300,000 research grant award recognizes Ntziachristos’ pioneering work in enabling non-invasive and continuous monitoring of human biology.

    2026/06/23

  2. Press Releases

    Merck KGaA, Darmstadt, Germany, Opens €20 million Metrology and Inspection ...

    New site expands capacity for M&I tools fivefold, supporting chip manufacturers in advanced packaging and heterogeneous integration for AI chips.

    2026/05/05

  3. Information

    AGM: Beckmann to be appointed as CEO May 1

    Belén Garijo passed symbolically the baton to Kai Beckmann. Annual General Meeting approved dividend of € 2.20.

    2026/04/24

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