IMAPS - Device Packaging Conference 2021

17th International Conference and Exhibition on Device packaging. This IMAPS conference will now be delivered virtually!

Type of Event

Virtual Event

Our Participation


12 Apr 2021 - 15 Apr 2021

Our participation

Please visit our virtual booth at the show to chat to our packaging experts during the event!

Session 5G Applications – Advanced Packages, Processes and Materials 
A New Low-loss Photo Patternable Packaging Dielectric Material with the Option for Room Temperature Curing
Pawel Miskiewicz, EMD Electronics

Next Gen Applications Solutions
TLPS Pastes for Anywhere Embedded Passive Components in Substrates and PCBs
Catherine Shearer, Ormet Circuits, Inc a subsidiary of EMD Electronics

Live iNEMI Invited Session “5G Electronics Challenges: High Frequency Materials Characterization"
Wednesday, April 14, 2021 | 3 pm - 5:45 pm EST
Panelist: Richard Stephenson, EMD Electronics | “Benchmarking Resonator based Low Dk/Df Material Measurements”

 Live Industry-Sponsored Panel “5G MATERIALS Roadmap: Industry Voices”
Thursday, April 15, 2021 | 1 pm - 3 pm EST
Panelist: Richard Stephenson, EMD Electronics | "Connection Digital Living"