Electronic Components and Technology Conference (ECTC)
This years topics are electronic packaging technology, materials, assembly, interconnect design, device & system packaging, heterogeneous integration, wafer level packaging, 2.5D & 3D integration technology.
Type of Event
Virtual Event
Our Participation
Sponsor
01 Jun 2021 - 04 Jul 2021
Our participation
We are a sponsor of Sessions 12 & 14 at the show. View the technical session topics here.
The conference contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.
Join us to learn about new technology solutions, applications, and products for the packaging and interconnect industry!