Electronic Components and Technology Conference (ECTC)

The event brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE.

Type of Event

Virtual Event

Our Participation


01 Jun 2021 - 04 Jul 2021

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Our participation

We are a sponsor of Sessions 12 & 14 at the show.  View the technical session topics here.

The conference contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.