AVS 21st International Conference on Atomic Layer Deposition (ALD 2021)

ALD/ALE 2021 will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching.

Type of Event

Virtual Event

Our Participation


27 Jun 2021 - 30 Jun 2021

Our submitted papers

  1. Dr. Martin McBriarty

    Sr. Scientist at Intermolecular

    Oxidation Influences Etch Quality in the Low-Temperature Thermal ALE of Copper (ID1390)

  2. Bhushan Zope

    Sr Manager, ALD Applications CoE, Thin Film R&D

    Atomic Layer Deposition of Yttrium Oxide using a Liquid Precursor (Y-08)

  3. Guo Lin

    R&D Senior Scientist, ALD Applications CoE

    Thermal ALD Growth of Ir and IrOx Films Using (MeCp)ir(COD) and Oxygen