International Interconnect Technology Conference (IITC)

This conference is about interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications.

Type of Event


Our Participation


06 Jul 2021 - 09 Jul 2021

Our participation

We submitted a co-authored paper:

Title: Grain Structure-Resistivity Relationship of Ru ALD Precursors
: Michael Breeden{3}, Victor Wang{3}, Ravindra Kanjolia{1}, Mansour Moinpour{1}, Jacob Woodruff{1}, Harsono Simka{2}, Andrew Kummel{3}
{1}EMD Electronics, United States; {2}Samsung, United States; {3}UC San Diego, United States

Join us to learn about innovative research and development in the critically important field of on-chip interconnects, integration and metallization, including design, unit process, integration and reliability!