The 18th Device Packaging Conference (DPC)

This conference is organized by the International Microelectronics Assembly and Packaging Society (IMAPS) to exchange of knowledge & gain networking opportunities for meeting leading experts.

Type of Event


Our Participation


07 Mar 2022 - 10 Mar 2022


Join us to celebrate this great recognition of our Electronics’ commitment to and relentless efforts in sustainability. We strive to embed sustainable thinking in our processes and products, and are committed to foster best practices in promoting sustainable semiconductor manufacturing.

Our participation

  1. Jeff Catlin

    Head of Business Filed, Patterning Solutions

    "Award Recipients of the Sustainability 3D InCites Award "