AVS 22nd International Conference on Atomic Layer Deposition (ALD 2022)

Join us to discuss the latest technology of atomic layer-controlled deposition of thin films and now topics related to atomic layer etching.

Type of Event

In-Person

Our Participation

Sponsor

26 Jun 2022 - 29 Jun 2022

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International Convention Center

Ghent, Belgium

Description

Organized by the Association for Science and Technology of Materials, Interfaces & Processing (AVS), the conference is dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching.  Since 2001, the ALD conference has been held alternately in the United States, Europe, and Asia, allowing fruitful exchange of ideas, know-how, and practices between scientists. 

Our participation

  1. Martin McBriarty

    Scientific Manager at Intermolecular

    27 Jun 2022 - 15:00

    UTC+02:00

    Requirements Beyond Etch Per Cycle for Thermal ALE in Semiconductor Manufacturing

  2. Daniel Moser

    R&D Senior Manager

    28 Jun 2022 - 16:15

    Optimizing Vapor Delivery of Transition-Metal Diazadienyl Complexes for ALD Processes

  3. Bhushan Zope

    Head of Thin Film Technologies

    28 Jun 2022 - 17:00

    The Oxygen-Free Thermal ALD and Area Selective ALD of Ruthenium Film

  4. Daniel Moser

    R&D Senior Manager

    29 Jun 2022 - 16:15

    Synthesis of Crystalline Tungsten Disulfide Using Atomic Layer Deposition and Post-Deposition Sulfur Annealing

  5. Suin Kim

    Research Engineer

    Film Characteristics of Lanthanide Oxide Thin Film by Using Atomic Layer Deposition Method (Poster)