AVS 22nd International Conference on Atomic Layer Deposition (ALD 2022)

Join us to discuss the latest technology of atomic layer-controlled deposition of thin films and now topics related to atomic layer etching.

Type of Event

In-Person

Our Participation

Sponsor

Description

Organized by the Association for Science and Technology of Materials, Interfaces & Processing (AVS), the conference is dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching.  Since 2001, the ALD conference has been held alternately in the United States, Europe, and Asia, allowing fruitful exchange of ideas, know-how, and practices between scientists. 

Our participation

  1. Martin McBriarty

    Scientific Manager at Intermolecular

    Requirements Beyond Etch Per Cycle for Thermal ALE in Semiconductor Manufacturing

    27 Jun 2022 - 15:00 UTC+02:00

  2. Daniel Moser

    R&D Senior Manager

    Optimizing Vapor Delivery of Transition-Metal Diazadienyl Complexes for ALD Processes

    28 Jun 2022 - 16:15 UTC+09:00

  3. Bhushan Zope

    Head of Thin Film Technologies

    The Oxygen-Free Thermal ALD and Area Selective ALD of Ruthenium Film

    28 Jun 2022 - 17:00 UTC+09:00

  4. Daniel Moser

    R&D Senior Manager

    Synthesis of Crystalline Tungsten Disulfide Using Atomic Layer Deposition and Post-Deposition Sulfur Annealing

    29 Jun 2022 - 16:15 UTC+09:00

  5. Suin Kim

    Research Engineer

    Film Characteristics of Lanthanide Oxide Thin Film by Using Atomic Layer Deposition Method (Poster)