Linx Surface Preparation & Cleaning Conference (SPCC)
The event is an opportunity to leverage our technical presentations to increase brand visibility as the strategic materials partner of choice, support business growth&continue our position as a thought leader.
Type of Event
In-Person
Our participation
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Aiping Wu, Ph.D.
Head of SP&C Technology
Day 1 - Session 2: Development of Wet Etchant for Filling Material Removal to Enable 3D NAND Process
17 Oct 2022 - FROM 11:40 TO 12:00 UTC+09:00
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Rick Chen, Ph.D.
Semiconductor Materials
Day 1 - Session 4: Co-chair with Evelyn Kennedy
17 Oct 2022 - FROM 16:00 TO 17:30 UTC+09:00
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Laisheng Sun
Lead R&D Scientist
Day 1 - Session 4: Hydroxylamine Free Formulation Development for Post Etch Residue Cleaning
17 Oct 2022 - FROM 17:05 TO 17:25 UTC+09:00
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Rick Chen
Semiconductor Materials
Day 2 - Session 8: Co-chair with Meredith Beebe
18 Oct 2022 - FROM 15:30 TO 16:50 UTC+09:00