Solutions

A single channel partner for the production of integrated circuits


Semiconductors solutions

Wafer fabrication

Semiconductor wafer fabrication includes four main areas of assembly; deposition, removal, patterning and electrical circuitry creation.

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  1. Deposition Materials
  2. Directed Self Assembly (DSA)
  3. Spin-on Dielectrics
  4. Patterning Enhancement
  5. Photosensitive Patterning
  6. Process Materials
  7. Spin-on Hardmask
  8. Colloidal Silica for CMP

Packaging

Integrated circuit packaging is the final stage of semiconductor device fabrication. The housing or ‘package’ supports the electrical contacts that connect the integrated circuit chip to the circuit board.

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  1. Thick film resists
  2. Interconnects

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