Solutions

A single channel partner for the production of integrated circuits. EMD Electronics' extensive portfolio covers important parts in the front and back end of the value chain.

Semiconductor solutions

Wafer Fabrications

Semiconductor wafer fabrication includes three main areas of assembly: Lithography, Permanent Layer & Planarization.

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  1. Photoresists for Front-End
  2. Patterning Enhancement
  3. Process Materials
  4. Directed Self-Assembly (DSA)
  5. Spin-on Hardmask
  6. Deposition Materials
  7. Spin-on Dielectrics

Packaging

Integrated circuit packaging is the final stage of semiconductor device fabrication. The housing or ‘package’ supports the electrical contacts that connect the integrated circuit chip to the circuit board.

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  1. Photoresists for Back-End
  2. Interconnects & Conductive pastes

Versum Materials

Versum Materials is recognized globally for our extensive portfolio of specialty chemicals used in semiconductor deposition and stripping applications.

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  1. Versum Materials Website
  2. Solutions
  3. Products
  4. Resource Center

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