A single channel partner for the production of integrated circuits. EMD Performance Materials' extensive portfolio covers important parts in the front and back end of the value chain.

Semiconductor solutions

Wafer Fabrications

Semiconductor wafer fabrication includes three main areas of assembly: Lithography, Permanent Layer & Planarization.

Explore More

  1. Photoresists for Front-End
  2. Patterning Enhancement
  3. Process Materials
  4. Directed Self-Assembly (DSA)
  5. Spin-on Hardmask
  6. Deposition Materials
  7. Spin-on Dielectrics


Integrated circuit packaging is the final stage of semiconductor device fabrication. The housing or ‘package’ supports the electrical contacts that connect the integrated circuit chip to the circuit board.

Explore More

  1. Photoresists for Back-End
  2. Interconnects & Conductive pastes
  3. LED Packaging

By {{ authorText(item) }}

{{ item.publicationDate }}

Contact Us

Partnership is the ultimate competitive advantage. Let's work closely together to develop new products and maximize the effectiveness of our R&D.


You have accessed, but for users from your part of the world, we originally designed the following web presence

Let's go

Share Disclaimer

By sharing this content, you are consenting to share your data to this social media provider. More information are available in our Privacy Statement