Solutions

A single channel partner for the production of integrated circuits. EMD Performance Materials' extensive portfolio covers important parts in the front and back end of the value chain.


Semiconductor solutions

Wafer Fabrications

Semiconductor wafer fabrication includes three main areas of assembly: Lithography, Permanent Layer & Planarization.

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  1. Photoresists for Front-End
  2. Patterning Enhancement
  3. Process Materials
  4. Directed Self-Assembly (DSA)
  5. Spin-on Hardmask
  6. Deposition Materials
  7. Spin-on Dielectrics

Packaging

Integrated circuit packaging is the final stage of semiconductor device fabrication. The housing or ‘package’ supports the electrical contacts that connect the integrated circuit chip to the circuit board.

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  1. Photoresists for Back-End
  2. Interconnects & Conductive pastes
  3. LED Packaging

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