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Metrology and Inspection for Angstrom-Level Manufacturing
Presentation by Dario Alliata, PhD, Head of M&I Applications & Product Management
Watch On-demand
The Role & the Challenge of Metrology and Inspection in Advanced Packaging of AI Chips
Agenda
September 17, 2025 | 10:00 am - 11:00 am PDT
Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing
The Role & the Challenge of Metrology and Inspection in Advanced Packaging of AI Chips by Dario Alliata | Head of M&I Applications & Product Management of The Electronics business of Merck KGaA, Darmstadt, Germany
Sub-Micron Pitch Scaling of Hybrid Bond Interconnects: Metrology Challenges by Eric Beyne, PhD | VP R&D / Program Director 3D System Integration Program / Senior Fellow of imec
Moderator: Michael Weigand | Senior Application ManagerBrewer Science
Speaker
Dario Alliata | Head of M&I Applications & Product Management
Dr. Dario Alliata joined Unity-SC, now part of the Electronics business of Merck KGaA, Darmstadt, Germany in the U.S. and Canada. In 2016 as product manager and is now Sr. Director of Applications with focus on Advanced packaging and Specialty substrates & devices. He worked in the semiconductor industry for more than 25 years, initially in R&D centers and later in equipment makers. He spent his entire career developing process control solutions for securing the manufacturing chain in the semiconductor industry.
He received a MD in Physics from the University of Milan (Italy) and hold a Ph.D. in Physics & Chemistry from the University of Berne (Switzerland).
Semiconductor Materials
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