SEMI ASMC and SEMI WiS 2025 are co-located in Albany, NY.
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
Join us to discover the latest trends in electronic packaging technology topics, materials, assembly, interconnect design, device & system packaging, heterogeneous integration, wafer-level packaging, and more.
Type of Event
Other
Our Participation
Sponsor

Join us
The 73rd ECTC is the premier international event that brings together the best in packaging, components, microelectronic systems science, technology, and education in an environment of cooperation and technical exchange.
Contact Us
- Need support finding the right materials solution? Our team of specialists can help! Click here to connect at the event!
- Contact us if you have a tech question, if you need a quote or sample, or if you are looking for a tech document.
Related News
View All News-
Press Releases
Collaboration with Zebra Technologies to Create Safety and Traceability Solutions
We announced a new collaboration with Zebra Technologies today to address challenges around product verification, authenticity, and trust.
2025/03/27
-
Press Releases
First cyber-physical trust platform launched to tackle issues of product safety ...
We launched M-Trust™, a secure cyber-physical trust platform, addressing growing issues of product safety, traceability and counterfeiting.
2025/01/06
-
Press Releases
Merck KGaA, Darmstadt, Germany and Intel Launch Academic Research Program in ...
Merck KGaA, Darmstadt, Germany and Intel launch academic research program, involving eleven scientific institutions from six European countries.
2024/11/06
Upcoming Events
View All Events10 May 2025
SID Display Week 2025
Where the world’s electronic display industry meets at the symposium, exhibition, seminars and business conference.