The 19th International Conference on Planarization / CMP Technology

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At the conference, you will have an opportunity to discuss technologies, including FEOL and BEOL CMP, 3D/TSV, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, Green Devices, New Applications, Metrology, Cleaning, Defect Control, Process Control, CMP Alternatives, SiC, GaN, Sapphire and Diamond. The conference provides a place where like-minded researchers and engineers meet, discuss, and share experiences in their field of knowledge.

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As the demand for electronic products increases, semiconductor manufacturers are integrating legacy and new materials into their manufacturing processes. However, the sheer volume of electronic components required to meet global demand has placed further emphasis on eliminating materials-related productivity and yield killers. Downstream materials suppliers are expected to provide increasingly sophisticated materials with predictive performance to customers at competitive pricing, creating a need for a data ecosystem that can support end-to-end advanced predictive manufacturing.

To provide more predictive performance and eliminate the risk of quality disruptions, we have embarked on a full digitization and digitalization initiative to fully characterize our target
processes and automate data capture. We have implemented technical approaches and production improvements to enhance our capabilities in this area. By extending an AI-driven quality approach to the broader supply chain and data ecosystem, we believe end-to-end advanced predictive manufacturing can be accelerated for the semiconductor industry.

This presentation will focus on the development and implementation of our data ecosystem, including the technical approaches and production improvements we have implemented. Also, the benefits of extending an AI-driven quality approach to the broader supply chain and data ecosystem, and how this can improve end-to-end advanced predictive manufacturing in the semiconductor industry.