GLOBAL LEADER IN CMP TECHNOLOGY
Performance tested products with long POR track-record with leading global Integrated Device Manufacturers (IDM) at logic and memory fabs. Products are designed to provide high tunability and wide process windows to meet broad customer performance requirements.
Highly experienced applications technical team to work with customers on the tool for product adoption.
We have a broad Chemical Mechanical Planarization (CMP) portfolio, specifically targeting innovative new products:
- STI & Advanced Oxide Slurries
- Copper Bulk Slurries
- Copper Barrier Slurries
- Tungsten (W) and new metals (Co, Mo) Slurries
- Post CMP (pCMP) Cleans
- Wafer Polishing Slurries
What is CMP?
Chemistry and abrasion is used to polish the wafer surface.
why is CMP needed?
- Large Depth-of-Focus required
- Large Thickness Etch required
- Poor Step Coverage
- Uniform and Planar Surface
- Higher Performance
- Improved Die Yields and Device Reliability
- Simplified Lithography
STI, ILD and bulk oxide slurriesBrowse products
Cu Bulk slurries & Cu Barrier slurriesBrowse products
MOL MG & Contacts
W Bulk and Buff slurries, Co & Mo slurriesBrowse products
A wide variety of solutions for packaging applicationsBrowse products
Silica wafer polishing CMP slurriesBrowse product
Find the right material
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