Capabilities

GLOBAL LEADER IN CMP TECHNOLOGY

Performance tested products with long POR track-record with leading global Integrated Device Manufacturers (IDM) at logic and memory fabs. Products are designed to provide high tunability and wide process windows to meet broad customer performance requirements.

Highly experienced applications technical team to work with customers on the tool for product adoption.

We have a broad Chemical Mechanical Planarization (CMP) portfolio, specifically targeting innovative new products:

  • STI & Advanced Oxide Slurries
  • Copper Bulk Slurries
  • Copper Barrier Slurries
  • Tungsten (W) and new metals (Co, Mo) Slurries
  • Post CMP (pCMP) Cleans
  • Wafer Polishing Slurries

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