Surface preparation & Cleaning
Our mission statement
Dedicated to bringing to the market world-class advanced cleaning solutions for the semiconductor industry. The SP&C team works directly with customers to fill the needs of their unique cleaning applications in front-end, back-end, packaging and device/board-level wet cleans.
Effective wafer cleaning and surface preparation are critical to high yields. Our team is committed to helping manufacturers achieve optimum performance through creative product development, chemical expertise, and unmatched technical support.
Our ACT® products hold a strong position in IC Cleans which are also referred to as post etch residue or interconnect cleans.Dive deeper
Our Dynastrip® and AZ® Removers are optimized for efficient Thick Film Photoresist Removal and widely used in Wafer Level Package Cleans.Dive deeper
Focused on providing selective wet etchants for Logic and Memory.Dive deeper
Polymer Removal Chemistry
With our Dynasolve® product line, we also serve the Industrial, Spray Foam & Conductive adhesive market.Dive deeper
Find the right material
Our experts can help you find the right materials for your needs.