Wafer fabrication (front end process)

Our Solutions

Semiconductor wafer fabrication includes three main areas of assembly:

  • Lithography: Patterning Enhancement Materials, Photoresists, Process Materials, DSA, Spin-on Hardmask
  • Permanent Layer: Deposition Materials, Spin-on Dielectrics
  • Planarization: Colloidal Silica for CMP

Patterning Enhancement Materials

Patterning enhancement materials offer solutions that improve process margin, defect control and higher resolution patterning steps associated in semiconductor fabrication of advanced integrated circuits.

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Photosensitive Patterning Materials

Photoresist products for semiconductor device manufacturing used in the photo-lithography processes (wet/dry etching, implantation and metal deposition) corresponding to various exposure tool / processes. We offer positive and negative tone photoresists in the photo-lithography processes for semiconductor device manufacturing with varying feature offerings ranging from submicron to ultra-thick film resist products.

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Process Materials

High purity wet process chemicals for photolithography process in semiconductor device production.

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Directed Self Assembly (DSA)

Directed Self Assembly (DSA) materials provide cost effective patterning solution which enable further chip scaling. DSA combines bottom-up patterning and conventional top-down patterning.

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Spin-on Hardmask

Spin-on hard masks for advanced patterning technologies.

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Deposition Materials

Our deposition materials are chemistries enabling thin film Chemical Vapor Deposition and Atomic Layer Deposition of metals/oxides/nitrides for the next generation of advanced logic and memory devices.

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Spin-on Dielectrics

FEOL gap-filling solution with AZ Spinfil® spin-on dielectric technology.

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Colloidal Silica for CMP

Colloidal silica slurries for semiconductor chemical mechanical polishing (CMP) with Klebosol®.

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