Wafer fabrication (front end process)

Semiconductor wafer fabrication includes four main areas of assembly; deposition, removal, patterning and electrical circuitry creation.


Deposition Materials

Our deposition materials are chemistries enabling thin film Chemical Vapor Deposition and Atomic Layer Deposition of metals/oxides/nitrides for the next generation of advanced logic and memory devices.

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Directed Self Assembly (DSA)

Directed Self Assembly (DSA) materials provide cost effective patterning solution which enable further chip scaling. DSA combines bottom-up patterning and conventional top-down patterning.

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Spin-on Dielectrics

FEOL gap-filling solution with AZ Spinfil® spin-on dielectric technology

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Patterning Enhancement Materials

Patterning enhancement materials offer solutions that improve process margin, defect control and higher resolution patterning steps associated in semiconductor fabrication of advanced integrated circuits.

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Photosensitive Patterning Materials

Photoresist products for semiconductor device manufacturing used in the photo-lithography processes (wet/dry etching, implantation and metal deposition) corresponding to various exposure tool / processes. We offer positive and negative tone photoresists in the photo-lithography processes for semiconductor device manufacturing with varying feature offerings ranging from submicron to ultra-thick film resist products.

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Process Materials

High purity wet process chemicals for photolithography process in semiconductor device production.

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Spin-on Hardmask

Spin-on hard masks for advanced patterning technologies

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Colloidal Silica for CMP

Colloidal silica slurries for semiconductor chemical mechanical polishing (CMP) with Klebosol®.

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